ISO uses the term, Integrated Circuit Card (ICC) to encompass all those devices where an integrated circuit is contained within an ISO ID1 identification card. Identification cards — Integrated circuit(s) cards with contacts — Part 1: Physical characteristics. ISO/IEC specifies the physical characteristics of integrated circuit cards with contacts. It applies to identification cards of the ID-1 card type, which.
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Given the close coupling normally achieved between an IC card and the interface device one has to question whether this level of error control has sufficient benefits to outweigh the disadvantages. 7816- signals and transmission protocols.
7816–1 Adviser to Smart Card News. The ICC is probably the security man’s dream because unlike most electronic storage and processing devices it has security intrinsically built in. The ISO connector is so designed to constrain the silicon die size to about 25mm2 although it is possible to isso 35mm2 or more. It is largely concerned with the management of data files but it may optionally involve additional features such as cryptographic algorithms e.
The developed code is given to the supplier who incorporates this data as part of the chip manufacturing process.
ISO part 1 smart card standard
It has to be said that this part of the standard could be improved and there is currently some work taking place in ISO on iiso very subject. The chip itself varies considerably between different manufacturers and for a whole gambit of applications.
The card is personalised to the particular user by loading data into files in the PROM memory in the same way that the application code is loaded into memory.
The ICC which contains a CPU can handle more sophisticated applications and even multi applications since the CPU is also capable of processing the data and taking decisions upon the various actions that may be invoked.
In both cases gold bumps are formed on the die. Both of these parameters have problems. The ISO standard specifies the physical characteristics of the card. The security logic can be used to control access to the memory for authorised use only.
The application code could be designed as part of the mask ROM code but the more modern approach is to design the application software to operate from the PROM non volatile memory. The ISO standard aligns with the use of two widely used external clock frequencies, 3.
The ISO standard is designed to address electrical signals and reset signals for synchronous cards. The transmission protocol must take account of this need to turn the line around.
The specification of a card involves parameters that are common to many existing applications using the ISO ID-1 card. ANSI can be contacted to get the latest version of the standards. ISO Design and use of identification cards having integrated circuits with contacts Clearly the use of EEPROM memory must be strictly controlled where fraudsters can obtain a financial advantage by unauthorised use.
More recently there have been moves to remove this option with the front opposite to the side containing the magnetic stripe being the preferred position for the IC connector. Although the integrated circuit could contain its own clock circuit for driving the internal logic, in practice most IC chips are supplied with an external clock by the interface device.
Area 1 is for the number identifying both the card issuer and the card holder.
There is also effectively a minimum order quantity in order to achieve this low cost. All of these memories described so far are non volatile. Temperature stability is clearly important for some applications and ETSI is particulary concerned here, such that its higher temperature requirement will need the use of polycarbonate materials. However in the semiconductor industry generally two other techniques are used, the flip chip process and tape automated bonding.
There are two commonly used clock speeds, 3. Vss is the substrate or ground reference voltage against which the Vcc potential is measured. The half duplex refers only to data transmissions in one direction at a time which a PC is perfectly capable isoo managing with its UART. The die mounting and wire bonding processes involve a large number of iao and are therefore quite expensive.
Created inupdated inupdated in The early French cards put iwo IC module further off the longitudinal axis of the card than the standard eventually agreed by ISO. In the Smart Card world the term, application, is widely used to describe the software or programs that the IC implements.
It also defines the purpose, location and electrical characteristics of the metallic contacts of the card. Most contact cards contain a simple integrated circuit although various experiments have taken place using two chips. The standard requires the card to withstand 1, torsions without chip failure or visible cracking of the card.
This part of the standard has taken a lot of effort in order to reach agreement. The IC should still be operational at the end of the test. The clock signal is used to drive the logic of the IC and is also used as the reference for the serial communications link.
In practice the semiconductor manufacturers have a range of products for which the above parameters are pre-defined. Wire bonding is the most commonly used technique in the manufacture of Smart Cards.
It defines the basic commands for reading, writing and updating of card data. Mail this article Print this article. The random access memory RAM is a different kettle of fish, this is volatile memory and as soon as the power is removed the data content is lost.
Identification of persons using biometric methods is outside the scope of this standard. This standard applies to the ID – 1 identification card specified in ISO and includes cards which may have embossing or magnetic stripes.
These commands cover the entire life cycle of the card and therefore some commands may be used before the card has been issued to the cardholder or after the card has expired.
As a result it was eventually agreed that after a transitional period to the end of the position for the IC connector would be as shown in figure 9.
It further defined the oso of sleep mode not covered by ISO where the IC chip can reside in a latent 7861-1 preserving volatile memory contents with a maximum power consumption of uA. This memory is programmable by the user through the use of fusible links.