JIS Z Test methods for flat pallets (FOREIGN STANDARD). Available for Subscriptions. Content Provider Japanese Industrial Standards [JIS]. Standard (JIS Z ) was performed. From the obtained results, the possibility of practical application was exam- ined. Moreover, the manufacturing process of. JIS Z – JIS Z Test methods for flat pallets. Publication date: ; Original language: English. Please select.
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How the lot acceptance rate changes is illustrated by the operation 0062 curve OC curve in figure B. To serve as an example, consider the life L in equation IX This process is explained in detail as follows.
In general, once a semiconductor device has failed, it cannot be repaired and used again.
The probability that a device will fail before the time ti is known as the failure or non-reliability distribution function f ti. Using a fixed value, in equation IX, for the number of damages k received before failure, consider the failure distribution function F t1, k as a function of time t1.
Expected characteristics of the function fNorm x are these: In chemical reactions, if molecules reach the temperature above which they may react the activation energya reaction occurs. Number of pieces accepted. Introduction to Computing Systems 1 st Exam. The initial value for starting the trial is 0 and we perform N tests. The possible test results are limited to either 1 “failure or defect”or 2 “no failure or acceptance,” with no possibility of such results as “pending decision” or “exception acceptance” allowed.
This discrete model is termed the Bernoulli trial or sampling. That is, it is a non-maintainable component. Let us assume that floating dust causes an average of r mask defects on the surfaces of silicon wafers of a given lot.
JIS Z 0602:1988
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Such a phenomenon occurs with some probability. If two-sided probability of distribution is considered, then the above values, respectively, correspond to 2.
Subsequent lots are, however, subject to normal inspection. Unless otherwise specified, use Inspection Standard II. Let us assume that the device will fail when the characteristic value changes to XL.
JIS Z – Test methods for flat pallets (FOREIGN STANDARD)
The level of degradation of the device can be iis as a function of the leakage current i. The higher the temperature of the molecules, the higher becomes their energies, and so increasing the temperature quickens reactions. This approximates AQL values.
When equipment can be repaired by renewing a failed device, the mean value of the interval that operation is possible between occurrences of failures is know as the MTBF Mean Time Between Failures. The probability of defective items produced in the manufacturing process is p. If the sampled device is not returned non-replacementwe will have a hypergeometric distribution. Different ways are available for sampling n devices from N devices.
A.1 AQL Sampling Table
A typical example of this is the movement of molecules of a classical, ideal gas. It becomes the determining factor in the life of the device. Number of pieces rejected. The AQL plan measures the lot whose fraction defective is p1 as having the 002 acceptable quality level.
As long as there jia no great variation in the quality of this lot, the distribution of the life L as caused by the stress placed on the devices by the temperature T is expressed as a logarithmic normal distribution and should be analyzed as such. Displacement mm [single amplitude] v: